3rd Gen AMD EPYC processors with AMD 3D V-Cache (Milan-X)
AMD previewed the use of innovative 3D chiplet packaging technology in the data center with the first server CPU using high-performance 3D die stacking. The 3rd Gen AMD EPYC processors with AMD 3D V-Cache, codenamed “Milan-X,” represents an innovative step forward in CPU design and packaging, and will offer a 50% average performance uplift across targeted technical computing workloads.
- 3rd Gen EPYC with AMD 3D V-Cache will offer the same capabilities and features as the 3rd Gen EPYC processors and they will be drop-in compatible with a BIOS upgrade, delivering easy adoption and performance enhancements.
- 3rd Gen EPYC CPUs with AMD 3D V-Cache will launch in Q1 2022. DALCO is planning to offer server solutions with these processors.